Get more out of your SMT line with Pyramax ZeroTurn. Our dual chamber reflow oven eliminates process changeover time while preserving the process control that the Pyramax family of reflow ovens is known for.
Built on the industry leading Pyramax platform, TrueFlat is a unique reflow oven configuration to stop substrate warpage. Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt.
End solder voids with the new Pyramax Vacuum Reflow oven. Featuring easy process transfer and superior thermal profile control as well as full MES integration.
This video describes the features of BTU's Pyramax™ convection reflow oven, including the new dual-lane, dual-speed feature which essentially gives one oven the capability of two ovens. Pyramax ovens are known worldwide for superior reliability, unm
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