I.C.T Provide SMT Production Line solutions with Automated Optical Inspection (AOI) AOI is short for Automated Optical Inspection, which is widely used in the electronics industry to check the appearance of PCBA assembly at the back end of the cir
ML-A410 SMT Automated Optical Inspection Machine Feature ▶Economical and practical AOI. ▶High precision detection platform design. ▶Fast programming debugging integration. ▶Automatic recognize the Tip and Bottom side. ▶Professional SPC system.
Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine
500,000 components per hour Maximum Board Size: 18” x 20” (457mm x 508mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
500,000 components per hour Maximum Board Size: 22” x 20” (560mm x 510mm) Clearance: 2” (50mm) top and bottom Minimum Component Size: 0201; 01005 with high magnification option
The VisionPro AV862 AOI system from ASC International offer a full compliment of attribute defect detection to control your component placement process. The price to performance leader when it comes to offline AOI. Contact ASC International for a
This is a brief demonstration showing the 2014 YESTech FX operating. This machine is available at the Capital Equipment Exchange. www.ce-exchange.com
Ultra-High speed measuring Measuring rate up to 40 steps per second helps reduce tact times and can actually be used in fully automated production lines averting a bottleneck. This is indeed a unique strength of Hioki’s flying probe testers. Fine pi
TR7700 SIII DT is a high performance desktop AOI solution designed for maximum precision and ease of use. Using TRI’s exclusive multi-phase lighting and next generation inspection software, TR7700 SIII DT delivers excellent defect detection with quic
#Xray#Inspection#SEC Nano-focus Tube of 200 nano resolution which is specialized for sub-micron defects of Semiconductor Packaging, Wafer Level Packaging(WLP). -Non-destructive Analysis System -High-Resolution Image with Dual Type CTs -Application
