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Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method.

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Can be used with more than underfill: multiple chips on boards can benefit from the Fids-on-the-Fly feature. Up to 5.5x faster than traditional stop and capture method. http://www.nordsonasymtek.com

ASYMTEK Products | Nordson Electronics Solutions

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SMTAI 2024 - SMTA International

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