1.The top heater can move freely along the X, Y axis in the IR preheating area It is good for many BGA chips distribution at different positions in the PCB board which need repair X-shaped infrared laser can do rapid location After location the elect
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
| 1 |
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
3 Morse Road 2A
Oxford, CT USA
Phone: +1 203 592 8723
