Videos: lga pad solderig (Page 1 of 1)

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

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Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

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