MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Electrovert's DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave.
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
Safe, precision rework for SMD, BGA, and other high value chips The versatile SV560A rework station combines precision, reliability, and affordability in an all-in-one solution for all your rework needs, from complex, densely populated PCBAs to simpl
WINTECH provides new/used/pre-owned SMT, AI & PCB Assembly (PCBA) equipment of various brands. Also supply service, modification & original or local-made spare parts. We are also an appointed agent for well-known brands.
Equipment Dealer / Broker / Auctions
NO. 1 LORONG SAGA JAYA 6
PERAI, 09 Malaysia
Phone: 6043809899
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