Videos: mv3 local fiducials (Page 1 of 1)

ASM SIPLACE HS60 CHIP MOUNTER

Videos

Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50

Qinyi Electronics Co.,Ltd

ASM SIPLACE HS60 CHIP MOUNTER

Videos

Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50

Qinyi Electronics Co.,Ltd

ASM Siemens HS60/569-12028957

Videos

SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50mm to 368 x 4

Qinyi Electronics Co.,Ltd

Pillarhouse Jade Mk II

Pillarhouse Jade Mk II

Videos

To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t

Pillarhouse USA

Fully automated bond tester

Fully automated bond tester

Videos

The Condor Sigma is the only truly fully automated bondtester in the world. In the video you see an operator clamping her sample on the Condor Sigma. She presses 'start', the tester references by fiducial mark, does a series of pull and shear tests a

XYZTEC bv

Ideal solution for 300mm (12 inch) wafer testing

Ideal solution for 300mm (12 inch) wafer testing

Videos

The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t

XYZTEC bv

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