General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
This elevator format oven utilizes vertical space to accomodate curing applications of up to 4 hours while only occupying 96" (2.5m) of floorspace. Perfect for underfill and encapsulant.
Shenzhen Zhuomao Technology Co., Ltd. Specialized in BGA/SMT Rework, Reballing, SMD LED (LED Display Module) Repair, TV LCD Laser Repair, X-Ray Inspection Machine Since 2005. We design and development of customized Non-standard BGA Rework System in
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-세계 최고 품질의 대류열풍방식으로 새로운 표준을 선도하는 HELLER Reflow Oven -10년 연속 World Wide Market Share 1위와 2014 SERVICE EXCELLENCE AWARDS 수상
459-1 Jangji-Dong, Kwangju-Si
Kyungki-Do, 13 South Korea
Phone: +82-31-769-0808
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