14 ribbons results

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Viscom AOI

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Brand new and original

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Sales manager: Mac Xie Mobile: +8618020714662(WhatApp) Email: at@mooreplc.com Skype: +8618020714662 Product Detail Flexible ModPack I/O configuration Analog, digital, serial, counter ModPacks 2 ModPack interfaces on a 3U board 8/16 bit dat

MOORE Automation Ltd.

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thru hole soldering and selective soldering needs

TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.

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Affordable inventory, manufacturing and order management software. Try SOS Inventory 2 weeks for free, no credit card req.