In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
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