Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Introducing the industry's only true dual mode 3D SPI and AOI inspection system for the electronics manufacturing sector. The LineMaster Fusion combines the best of ASC's 3D SPI sensor technology along with cutting edge image-algorithm based AOI.
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