This video describes the J-STD-001 solder certification program. It is an overview of the program, the certification requirements and the types of credentials. For More Information On IPC J-STD-001 Training Visit Our Website: IPC J-STD-001 CIT Cert
In the realm of electronics manufacturing, Automated IC Programming Systems epitomize efficiency. This guide navigates through diverse package types supported by these systems, showcasing their adaptability. From PLCC to BGA, these systems are the co
onsemi New and Original NCP361SNT1G in Stock IC TSOP-5 21+ package NCP361SNT1G Current and Power Monitors, Regulators SBN POSITIVE OVP WITH OCP 1. We are the Chinese Reliable Professional Electronic Components Supplier 2. All we sell are origi
Name: IC Testing and Sorting with Tube Model: HJC-8000T Used for: Applicable to all tube IC testing / sorting/burning/programming. Such as QFP / LQFP / PLCC / TSOP / BGA / QFN, etc. https://www.hjsautomation.com/product/ic-testing-and-sorting-with
Infineon New and Original S29JL032J70TFI320 in Stock IC TSOP-48 21+ package S29JL032J70TFI320 64Mb 3.0V Simultaneous Read/Write Parallel NOR Flash PIC18F25K22-I/SO SOP28 MICROCHIP 22+ SN74LV123ATPWRG4Q1 TSSOP16 TI 21+ sucs32405c DIP COSEL 22
onsemi New and Original in Stock IC TSOP-5 21+ package NCP361SNT1G Current and Power Monitors, Regulators SBN POSITIVE OVP WITH OCP 1. We are the Chinese Reliable Professional Electronic Components Supplier 2. All we sell are original and
This advanced level course provides instruction on effective techniques for the conductive and convective removal and replacement for advanced SMT packages including: 0402 and 0201 chip style parts, 15 and 20 mil pitch TSOP and QFP's, PLCC socket
Used for tube to tray package conversion. High speed mechanical arm swinging from track to tray for placing. CCD camera for accurate placing. Customized per tube specification and tray size. Category: SMD Tape & ReelTags: package conversion mach
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Demonstrates desoldering, solder paste printing, and installation of a fine pitch QFP 208 (30.6mm x 30.6mm) component using an ATCO model AT-GDP Placement & Rework Station.
