Electronics Forum: (4) (Page 411 of 664)

Dross or Dark Green Mud Found in HAL machine

Electronics Forum | Sat Jul 02 10:27:19 EDT 2022 | madisreivik

Hello ! I got exp only with leadfree HASL, but maybe the same problems apply. Also, the leaded HASL has probably lower process temperature. This could be copper, which has settled to the tank bottom. With leadfree, the copper is removed from molten

YV100XG Password and how to change AxisNo

Electronics Forum | Tue Nov 01 16:09:38 EDT 2022 | kamedatec

The machine had the Auto Tray installed but was removed to put here in the company because the machine was bigger than my elevator. The owner told me it was working, which made me waste time testing all possible settings, electronic cards and cables.

Choosing a printer...

Electronics Forum | Sun Jun 04 21:10:05 EDT 2023 | spoiltforchoice

> We own the Ekra X4 and pleased with it. Solid > phone support from factory in the US. Do review > GKG out of Asia which is supposed to be $20-$30k > usd https://www.gkgasia.com/smt-printer-g-titan/ > In speaking with Koki, they

Flason SMT Products

Electronics Forum | Thu Oct 04 00:03:28 EDT 2018 | gaintstar

flason smt pick and place machine: http://www.flason-smt.com/product/Hanwha-IC-placer-SM321-High-Speed-SMT-Modular-Chip-Mounter.html http://www.flason-smt.com/product/Hanwha-Pick-and-Place-Machine-DECAN-F2-High-Speed-SMT-Modular-Chip-Mounter.html htt

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray

| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk

Re: Qualifying new PWB Vendors

Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon

| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have

Re: smt reliability vs thru hole

Electronics Forum | Tue Jan 18 12:36:11 EST 2000 | Dave F

Dave: I haven't located something to support your contention, yet, and I'm not going to comment on the factors that drive reliability beyond component selection, because I know that you've got some sweaty-palmed sales type wringing his hands waiting

Re: Missing SMT Chip Components

Electronics Forum | Wed Sep 15 03:11:33 EDT 1999 | Charles Stringer

| | | Hi, | | | | | | Recently encountered missing components problem at the SMT process. | | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post r

Re: Air-Vac stuff

Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM

| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad

Re: Micro-BGA soldering

Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon

| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol


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