Electronics Forum | Tue Jun 11 14:45:59 EDT 2002 | stefwitt
I can not find a F4G in Fuji�s equipment list. Siemens has a F4 ( flexible fine pitch machine ) and also a GII ( glue dispensing machine ), which both would make sense to add to your equipment list. Machines are �connected� together with their conve
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Tue Jan 17 23:25:55 EST 2012 | ngineer
I think I've got it. 1. Black flat connectors are for the nozzle changers, and whether or not the tab is pushed in or out (depending on whether they are placed in front of one of the blocks on the feeder base doesn't matter at all, the blocks are th
Electronics Forum | Mon May 26 03:27:00 EDT 2014 | julianf
Thanks for your reply Sarason. I'm aware now that my goals seem very ambitious and infeasible. Let me formulate my problem in an different way that might be more realistic. Is it possible to measure a DIFFERENCE in strain between top and middle la
Electronics Forum | Tue Jun 06 13:38:27 EDT 2023 | spoiltforchoice
> It is really strange you don't have EKRA on your > list. EKRA are really good for protos and > mass-production too. We have E5, X5 and two > X4Prof. X4Prof are lasting forever if you handle > and maintenant them properly. ESP001
Electronics Forum | Tue Sep 05 16:04:43 EDT 2000 | Dave F
Pascal: Responding to your questions: 1 Do we have to dry the PCB after cleaning (sic)? Generally, nothing says you have dry the PCB after aqueous cleaning. Along this line, I received several thoughtful responses when I posted a similar thread.
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Electronics Forum | Tue Jun 12 20:59:14 EDT 2001 | ianchan
Hi mates, actually my whole problem, is whether to : 1) To offset the heat-absorb ability of the Pallet, that artifically lowers my pcba temperature, is it advisable to artifically increase the overall, oven zone temperatures? offset by estimated +
Electronics Forum | Mon Jul 26 12:55:34 EDT 1999 | M.L
Presently protos of micro-bgas (80i/o) pitch .030/.031 12BGA per assembly The board is a (.062, 4 layers) FR-4 using Dry film Pads .014inch Vias within footprint .020inch Vias to be filled by bottom side(solder side) only .030in dia. Force via plugg
Electronics Forum | Sat Aug 22 00:23:10 EDT 1998 | Arul Vanan
We are using PCBs of CEM3 Material with bare copper fiducials. The whole board is of bare copper with a lacquer coating (Coats brother S2974). The fiducials are of 1 mm diameter bare copper. we use Panasert MV2F as well as Fuji CP4-3. In both the m
