Electronics Forum | Thu Jan 06 08:03:47 EST 2005 | davef
On solder in vias: It looks like the via are not solder masked well and pick-up solder either: * Solder coating ... OR * During leveling It's possible that the design specifies openings in the solder mask for these via. On solder in the unsupporte
Electronics Forum | Sun Mar 05 14:08:33 EST 2006 | grantp
Hi, Your right, and the MYDATA's are much easer to setup, and a lot of it's got to do with them knowing which way a part is oriented, and it makes it a lot easer to know by looking at each part if it's rotated correctly. The Fujis don't do that, and
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Tue Feb 08 22:37:03 EST 2005 | davef
Your company has chosen to define its requirements for tracebility as it has. So, people there should be able to help you understand their purpose and intent. For instance: * We distinguish between 'repair' and 'rework'. Repair requires a MRB ac
Electronics Forum | Mon Mar 07 18:41:13 EST 2005 | jimmyb
--IE, Funny.--- I "remember" kinda, from the early CP6 years, things about the springs. The early Fuji springs had sharp ends, and if you spun the nozzle, prior to final attachment, the opposite way it could stick, and if it was spun the right way,
Electronics Forum | Sun Apr 10 03:25:35 EDT 2005 | Peter
Normally, some conformal coatings do not have very good wetting properties, that should be basic function of a good coating material (the same reqirement as avoid bubbles during coating process)! For UV curing conformal coatings, you can try Lackwe
Electronics Forum | Mon Feb 21 03:35:38 EST 2005 | abhirami
Thanks Grant and Dave. I have done extensive work on this and found some of the solder balls and solder flux does match my requirements. We have done many tests and have a good responses for both ceramic and plastic substrates. All is fine as long a
Electronics Forum | Tue Mar 01 14:47:48 EST 2005 | cabjerk
Hi: We started many years ago with totes on shelves 30 reels per side. Then we moved to 12" shelving with reel boxes. 5 reels per box. It was cheap and each was a single location. Great for finding and decrease cycle time in finding parts. Our wh
Electronics Forum | Mon Feb 21 03:51:37 EST 2005 | abhirami
Solder paste thickness control is more important in SMT process. What controls do you have? I guess if everyone follows the critical control path, then there are always reduced problems. The issue is no one is perfect. Paste tends to be on the stenci
