Electronics Forum | Sun Jul 08 06:38:41 EDT 2007 | dilogic
We have an old GSM1 (I-block, USOS V1.4.14, two 4-spindle heads, changers between rails). When I configure machine so there are no nozzles on heads and changers are filled with required nozzles, except for one empty hole, machine won't pick up nozzle
Electronics Forum | Tue Jul 10 19:16:08 EDT 2007 | 5why
We have filed returned (approx. 5%) of the boards that exhibit inner layer short @ a particular connector locations. X-section revealed there exhibit Cu residue, but aside from that, we also suspect there could be organic contaminant, what test shou
Electronics Forum | Fri Jul 13 08:54:18 EDT 2007 | rgduval
Has your board house reviewed the PCB layer stack? Make sure that the layers are balanced in copper weight, etc? Have you tried pre-baking the boards? We just had an issue with some boards warping that have never warped before for us. It happened
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Fri Jul 20 08:16:38 EDT 2007 | chrispy1963
I agree that it would be crazy to think that every part a company manufactured had to be re-engineered to allow for higher temps. Out of the question and I NEVER implied that at all. What I said was that Zarrow told us that it was alright to use lea
Electronics Forum | Tue Jul 24 08:44:17 EDT 2007 | rgduval
Ron, I'd agree that that sounds high. Some things that may be contributing to it: Volume. lower build quantity often leads to higher placement costs. NRE. Does this website quote an NRE for solder stencils, machine programming, and reflow profili
Electronics Forum | Mon Aug 06 11:58:48 EDT 2007 | gmoritz
Do you have BEC (Board Error Correction) > on that machine, and if so, did they > give you the alignment plate for it? I don't know if we have BEC on the machine. I can't even search the 550 page manual that was finally sent to us in a pdf file
Electronics Forum | Mon Aug 06 14:05:02 EDT 2007 | slthomas
BEC hardware would be on the machine as a sensor underneath the placement table, to the left of the C&C, and an emitter attached to a bracket to the left of the insert head. The two line up with each other and the sensor uses a quadrant layout to det
Electronics Forum | Fri Jul 27 08:49:35 EDT 2007 | cman
We are currently have failures on one of our QFN > components. We are running this product with > lead free paste, lead free boards and lead free > parts. They have done a pull test on this > component and it showed that the solder joint > mai
Electronics Forum | Thu Aug 02 11:46:22 EDT 2007 | realchunks
Congrats Shrek - sounds like you found your heaven, blaming others. About "IT". Wow, what kind of hype was that? I thought this would be something worth reading. Looks like a first year Project Manager thought of this. I agree, who ever thought
