Electronics Forum | Fri Aug 07 07:55:30 EDT 2009 | robhs
Hi. We are planning a production run of a board that utilises the SEMTECH SLP2710P8 8-pin device (2.7 x 1.0 x 0.58mm). The part orientation on the board necessitates that the squeegee print direction approaches the stencil apertures on the long side
Electronics Forum | Fri Aug 07 11:15:15 EDT 2009 | davef
All major solder suppliers should be able to meet your stated requirements. Try: * Kester ; 515 East Touhy Ave, Des Plaines, IL 60018-2675; 847-297-1600 847-699-5548 kester.com * Heraeus Incorporated, Circuit Materials Div.; 24 Union Hill Rd, West Co
Electronics Forum | Fri Aug 07 09:53:12 EDT 2009 | kpm135
The Z-axis Drive card on our MPM UP2000 HiE fried. We replaced it with a new card, setting all the jumpers to match the old card. After that we had to recalibrate the Z-axis and the snugger height but the problem is that the camera is now too close t
Electronics Forum | Tue Aug 18 10:17:15 EDT 2009 | grantp
Hi, You don't need X-ray and all that crap. I would get an old MYDATA TP9 or something like that, and a manual stencil printer and a batch oven or a small inline oven. Should do the trick and be very low cost. Should be simple to use as well. Tha
Electronics Forum | Fri Aug 14 18:48:36 EDT 2009 | secura1
It's some time difficult to control process when > using a heat gun. What is the intent of using the > heat gun after test? we agree... the heat gun method was an experiment. We are planning to us a hot air re-work station. The intent is to re-
Electronics Forum | Thu Aug 20 15:10:21 EDT 2009 | davef
Responding to your points: * The intermettalic layers [ie, Cu6Sn5, Cu3Sn] between the solder and the copper pad is the same composition with both lead free and leaded solder. The lead in solder has no impact on the intermetallic. * As you say, increa
Electronics Forum | Thu Aug 20 18:11:53 EDT 2009 | smt_guy
Hi davef, thanks again for that enlightenment. I'm just curious about what's happening with the solder joint of the said process. Again to add to my unending queries for now: So on top of that copper is a thin layer of lead-free solder composition
Electronics Forum | Thu Aug 20 10:54:25 EDT 2009 | newpic
What is the minimum Tg for FR4 board to consider as Lead Free board? My issue is, I do not know what is the web for the V-Score for a FR4 Tg 180. I use to use a FR4 Tg 140 and there is no problem with it, but since we convert to Lead Free and the
Electronics Forum | Fri Aug 21 00:27:09 EDT 2009 | boardhouse
Hi To Start Min Tg is just a portion of picking a lead free material, the other is Td. We recommend the following to our Customers. 2-8 layer 150 Tg. Min. / 340 Td. 8-Up. 170-180 Tg.Min. / 340 Td. The above recommendations have been used by man
Electronics Forum | Fri Aug 21 04:43:14 EDT 2009 | ghepo
Hello, I suggest you visit the website http://www.analysispcb.com, where I found these information : PARAMETERS FOR DOUBLE “V” SCORING LEAD FREE LAMINATES Typ WEB Thickness, 1.6mm : 0.38mm (+.15/-0) "...Tg is not a good indicator of a materials’
