Electronics Forum | Mon Aug 05 09:06:29 EDT 2002 | Adam
I'd like to ask for feedback on monitoring the reflow oven using a copper plate.Are there any articles relating to the above, in the sense of what size the copper plate should be, how many thermocouples should be attached, the frequency of measure me
Electronics Forum | Tue Aug 13 09:31:48 EDT 2002 | ksfacinelli
I am looking at placing a Altera BGA device that has a .45mm Nominal Ball Dia. with a .8 spacing c-c between balls. The PCB will be gold plated so co-planarity should not be an issue. Interested in suggestions that may assist producability when pla
Electronics Forum | Mon Aug 19 09:42:56 EDT 2002 | blnorman
I agree with analysis. You'll never accurately find the source until you determine exactly what the "goo" is. We have this problem, but like previous posters, the goo is flux residue. We do use the ovens for both reflow and adhesive cure. The adh
Electronics Forum | Thu Jan 09 21:19:49 EST 2003 | caldon
Let me through my hat in the ring...I know this is not the forum but what the hey. I have to much experience to list. Just email me at cal_driscoll@hotmail.com. DAVE F. FYI- My comments on here will be from me as an independent as I was let go from
Electronics Forum | Wed Sep 11 06:48:19 EDT 2002 | gerits
Dear Sir, We as Assembl�on (member of the Royal Philips group, former Philips EMT) have several solutions for you or we can give you support with your request. Either on how to handle the components manually or automated. Feel free to contact me or
Electronics Forum | Tue Aug 20 21:46:09 EDT 2002 | davef
Rinse => OSP Coat => Rinse => Dry Hot Air Solder Level: Preclean => Rinse => Flux Coat => Solder Coat => Hot Air Level => Cool => Soft Brush => Post Clean Rinse => Dry Look here http://www.epa.gov/opptintr/dfe/pubs/pwb/ctsasurf/download/pdf/ch2.pdf
Electronics Forum | Wed Sep 04 14:14:55 EDT 2002 | melo_guy
I like that "Lies, dam lies and statistics." thats a riot, only because its SO TRUE. Ill remember that i'm sure ill be able to use it sometime. My company does a lot of those graphs and charts that all relate to things that make no sense. I'm in c
Electronics Forum | Sat Sep 07 06:57:33 EDT 2002 | mk
I agree but, are there really heavy metals in this water? Our process is as follows. Print Paste Reflow Board (no components, water soluble paste only) Wash Board Same reflow profile for almost every order so no solder balling issues etc. Carbon an
Electronics Forum | Thu Sep 12 18:50:17 EDT 2002 | scottefiske
Sorry so late in getting into this tehcnical issue. I have seen this condition before...90% of the time in conditions of adhesion on a water soluble material... is the paste...exposure time, lot issue, etc..basically the paste's carriers and binders
Electronics Forum | Tue Sep 10 19:08:59 EDT 2002 | cp743
Brian, I believe that someone has given you incorrect info. Both of these vision types ignore protruding nozzles during vision processing. I am currently running 1608 components with a 1.0mm nozzle on a CP-643E series machine utilizing vision type
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