Electronics Forum: /02 (Page 706 of 1283)

Leadfree component plating on Sn/Pb paste

Electronics Forum | Mon Jun 23 11:02:33 EDT 2003 | Kris

Hi, No Major issue using lead-free plated components in tin-lead as long as Sn/Bi is not the finish. I think some customer might be worried about low melting phase. More voiding may be seen in case of ceramic capacitors used with tin-lead. It is

Package Dimensions

Electronics Forum | Fri Jun 27 15:37:02 EDT 2003 | caldon

Charlie- You answered your own question...1206, 0201, 0603, 0805, 0402 are all the package dimensions. In addition Here is a generic link from practical components that list most package sizes, feeder size, tape type... http://www.practicalcomponen

Silica gel in final packing

Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef

If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y

Naming Files

Electronics Forum | Wed Jul 02 06:34:32 EDT 2003 | mkehoe

???? What? I think I follow your logic. Bottom line is, using the same name, p.1 (that's p (dot) 1) over and over for every stencil you produce can lead to confusion both in our CAM dept as well as our vendors. Like calling every board you produce PN

Naming Files

Electronics Forum | Wed Jul 02 17:46:23 EDT 2003 | csimfgeng

WOW! Just when you thought you had seen it all! I follow your logic perfectly and concur. I bet the first time your customer loses a valuable customer because of a file mix-up, they may change their tune. "Doing things the way they have always

ultra sonic cleaning

Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna

We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the

piece part handling

Electronics Forum | Wed Jul 02 14:25:14 EDT 2003 | Earl Wildes

Greetings. Does anyone know of a good reference on the proper physical handling of surface mount devices? We have a number of very small builds, so our stockroom is very often issuing single piece quantities. The parts are protected from ESD, but

Strain Gage Analysis tips

Electronics Forum | Mon Jul 21 16:06:02 EDT 2003 | davef

We doubt that stain gages will provide the granularity or repeatability to provide meaningful data. Contact: Cemal Basaran, Dr Associate Professor SUNY Buffalo Work: 716-645-2114 X2429 Fax: 716-645-3773 E-Mail: cjb@eng.buffalo.edu 243 Ketler Hal

eSMT software

Electronics Forum | Fri Jul 25 08:22:02 EDT 2003 | cabjerk

Hi All; Does anyone have any experience with eSMT software for Fuji machines? (replacement for MCS) Here is the web site for the software http://strony.wp.pl/wp/esmt/ I'm having problems with the software and an IP1. The Error on the machine is E

Suction Tape

Electronics Forum | Thu Aug 07 16:00:02 EDT 2003 | caldon

Yes you are correct Barry. The Suction tape provides a flat surface for the PNP nozzle to pick -up. In some cases I have seen a plastic "cap" ove rthe pins to provide the same thing. The cap can be reused. Both require, unfortunatly, manual removal


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