Electronics Forum | Thu Aug 24 15:54:13 EDT 2006 | davef
It depends. What is: * Storage environment and period * Board laminate, epoxy, and copper thickness of PTH * Down stream process * Etc FR4 0.062" thick boards absorb between 0.08 to 0.1%Wt of moisture within a 24 hour period, and 0.2 to 0.23%Wt in
Electronics Forum | Wed Jul 16 18:46:46 EDT 2008 | mariss
emti, Thank you for the reply but I'm looking for a reasonable quality pcb mfg. We do SMT and thru-hole in house (3 Juki KE-750L machines) of our product. My problem is with the bare boards: holes poorly registered with top copper, solder masks mis
Electronics Forum | Wed May 21 14:44:38 EDT 2003 | blnorman
We currently use Vigon SC-202 in our spray in air system. SC-202 has 830g/l VOC content, so I don't know if that will help reduce your VOC's or not. We used Smart Sonic 440-R in ultrasonic application with great results, but we haven't tried it in
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Fri Oct 01 06:28:08 EDT 2004 | Dolby Laboratories
From time to time, component suppliers decide to discontinue production of components that we use in our products. Occasionally, these components can be sourced elsewhere or designs adapted or altered to accommodate alternates. In many cases, however
Electronics Forum | Tue Nov 14 10:22:07 EST 2000 | Stefan Witte
Without using a glass plate you could check if your jaws could properly align the compomnents by writing a small vice versa program. Place a component in a 0 degree angle and another one right next to it in a 180 degree angle. Built up a line of lets
Electronics Forum | Wed May 22 15:56:43 EDT 2002 | stefwitt
The play of the tape is quite significant as I mentioned in an earlier thread. Tape width can vary between 8.1 +/- 0.2mm. Demos on 0201's are most likely done with 8.1 +/- 0.05mm tape. I guess you are referring to the cover tape pull, which can dispo
Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
