Electronics Forum: 003 (Page 8 of 13)

Re: Gold Bump Flip Chip Attach

Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler

| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The

Re: Micro Vias in Pads

Electronics Forum | Tue Mar 24 11:20:18 EST 1998 | Earl Moon

| Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via? Typically, micro vias are drilled and plated to about .003" diameter. To avoid significant solder "drain off," they should be drilled as shallow

Voiding in uBGA's w/blind uvia's in pads

Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve

Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men

Ceramic capacitors cracking

Electronics Forum | Mon Mar 03 05:35:21 EST 2003 | Kelly

We just had this issue a couple months ago with a single sided FR-4 board which was scored. We found that the design was a factor but also the depth of the v-score. Since then we have re-designed the part further away from the score line. At the same

Questions about SMT Process Control

Electronics Forum | Fri Aug 13 09:09:11 EDT 2004 | davef

Solderability standards are: * IPC EIA J-STD-002B - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * IPC EIA J-STD-003A - Solderability Tests for Printed Boards Not intending to insult you, but terms used to descr

Set Command Variables

Electronics Forum | Fri Feb 11 08:44:26 EST 2005 | pemnut

We use these machines to insert swedge pins. When I first started here, there were certian programs that we ran that required us to put in a machine offset of +.120 in the X which is a lot. after learning the machines better, I realized that whoever

System is too slow, Will memory/speed increase do job?

Electronics Forum | Sun Jun 26 21:52:15 EDT 2005 | thaqalain

After inserting 128 MB,168 Pin,PC100-222-620 (AZEN RAM)(taken out from another computer) alongside present Kingston KVR133x64C3/128,this data is copied from Systeminfo.txt file and for your kind review/suggestions. Total Physical Memory: 126 MB

V-scoring design and equipment questions

Electronics Forum | Wed Jun 14 10:12:33 EDT 2006 | Board House

Hi all, The majority of score machines used today have a top cutting wheel and bottom cutting wheel. This way they can score a line in one pass and saves on programming time, Panels are typically scored in one direction first and then the panel is r

Baking MSDs in tubes?

Electronics Forum | Mon Mar 26 22:57:28 EDT 2007 | sleech

Paul: You are dead-on! Desiccant and nitrogen cabinets are a great way to maintain the current moisture content level of a MSD package. But if you look at the 40 degree C schedule (Table 4-1) in J-Std-003B, you will find that the drying capability o

PCB pad contamination

Electronics Forum | Tue Aug 21 05:05:52 EDT 2007 | vangogh

Hi All, I would like to get some inputs regarding this.... I have bare PCB which were stored with kapton tape attached on the Au plated pads. These were stored for close to a year. Upon removal of kapton tape, we noticed discolorations on the edges o


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