Electronics Forum: 1..4 (Page 21 of 22)

Re: Z-axis panel movement on full perimeter routing.

Electronics Forum | Tue Jan 05 13:53:35 EST 1999 | Chrys

| Hi All, | I work with CNC Routers . | I use full perimeter routing of double sided populated panels, in a high volume/ mix application environment. We chose stand alone routing machines for our facility . | I'm interested in your input for bette

United Kingdom electronics manufacturers employing SMT

Electronics Forum | Fri May 29 06:02:58 EDT 1998 | Centre for Operations Management

To: United Kingdom electronics manufacturers employing SMT The Centre for Operations Management at London Business School (United Kingdom) is currently carrying out a study of quality management practices in the electronics industry. The "TQM in the

Non-wetting on QFP lead

Electronics Forum | Wed Nov 21 19:45:36 EST 2001 | Yngwie

Hi Guys, I need help. I�ve a trouble with non-wetting problem on the lead of 208 pin, 20 mils pitch QFP. We are on intrusive reflow. I never faced this problem before on this product after running them for about 2 years now. This occurred on one pa

Heller Heating Element

Electronics Forum | Tue Nov 13 00:05:11 EST 2012 | eadthem

Typical problems with our heller 1707 EXL would be blower issues. We have almost replaced every blower on the top sense purchase. Fortunately Heller is very good about honoring there warranty on the blowers which is quite long, Might be lifetime not

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 19:09:25 EDT 1999 | JohnW

| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy

| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p

Re: No-Clean Paste Lab Test Evaluations

Electronics Forum | Sat Feb 14 19:35:51 EST 1998 | C. Lao

Mr Lao We have some specialist knowledge on this subject and offer both equipment and services for these tests. My first recommendation is that take coupons manufactured by your PC Fabricator and then samples at each manufacturing stage: Bare coupon

Military Lamina bake-out

Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef

IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i


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