Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Fri Nov 20 01:00:50 EST 2015 | anilwagh
I am looking below parts of CP4-2. 1)1P150E-24-2 3)2MMB500U-01-1 3)3MMB50-4-1 4)4P300E-05-1 5)CACR-SR03BC IKS-Y264-1 6)CACR-SR10BC 1KS-Y262-1 7)CACR-SR44 BC 1BF-Y279-1
Electronics Forum | Mon Oct 12 15:51:47 EDT 2015 | davef
IPC-A-610E-2010, Acceptability of Electronic Assemblies, 8.3.4 Castellated Terminations talks to the acceptability of solder connections on components like yours. It’s tough to say from the pictures, but I’d say your issues are: Missing solder: Plat
Electronics Forum | Tue Mar 07 13:21:03 EST 2000 | Tuan Bui
Hi John, Aerofeed,Inc. has the "Dry box" nitrogen cabinets. 215-257-1152 and they are in PA. I purchased one last year and it has been doing a wonderful job for our operations. I use it to store BGAs and micro BGAs after baking. To reduce the cost, I
Electronics Forum | Tue Mar 07 13:21:03 EST 2000 | Tuan Bui
Hi John, Aerofeed,Inc. has the "Dry box" nitrogen cabinets. 215-257-1152 and they are in PA. I purchased one last year and it has been doing a wonderful job for our operations. I use it to store BGAs and micro BGAs after baking. To reduce the cost, I
Electronics Forum | Tue Jun 17 01:38:01 EDT 2003 | Dreamsniper
Hey fmonnette, What's wrong if I have a dry cabinet and baked all my components under 1-3%RH or say 5%RH regardless of their MS Level, whether they r level 4, 5, 5a, 6 etc.... What will be my problems in doing that process? just for curiosity, th
Electronics Forum | Thu Jan 09 10:26:58 EST 2003 | Hussman
Cool! A 3 year plus thread! Well, to answer your question, don't build it yourself. Manufacturing is completely different from engineering. I could spend the next 3 yeras explaining why you shouldn't, but it appears this has already happened. An
Electronics Forum | Thu Dec 09 05:01:30 EST 1999 | Patrick Wong
I am task to qualifiy a process for BGA with 560 bumbs and is 1.3" width and if possible also to determine if nitrogen is necessary. BUT I do not know that are the test required and what standard should I follow. I know I will have to reflow the BGA
Electronics Forum | Tue Nov 09 11:50:33 EST 1999 | Steve Owen Snr prod eng.
We have recently purchased equipment that would probably solve your problem. We are using 1.6mm pcb material 1/3 of which is left unscored. When the pcb is de-panelized there is no damage to any components and we have cut our break time in half.
Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef
Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder
