Electronics Forum | Fri May 25 14:47:14 EDT 2018 | tech1
1:1 is a good start. A little more info would probably be helpful in answering this query
Electronics Forum | Wed Aug 07 12:41:58 EDT 2019 | slthomas
Are the apertures on the stencil reduced in width or 1:1 with the pads? It depends on the pad width and foil thickness but we usually reduce aperture width for any part that results in an aperture wall spacing of less than 8.5 mils.
Electronics Forum | Fri Mar 12 13:17:27 EST 2021 | vasu278
I bought new M8 reflow, i got 4 cables for ups connection ups+,ups-,1+,1-. I want to know how to connect it to ups
Electronics Forum | Tue Dec 20 10:10:21 EST 2005 | SteveH
Ours is the same configuration as that, we run with neat Humiseal 1B31 through the needle valve and a 1:1 blend 1B31/Butanone (MEK) in the spray valves. Programming is done via a PC using the pendant and the path is point to point trained on scrap P
Electronics Forum | Sat Jun 23 11:41:34 EDT 2007 | grantp
Hi, We use 1:1 for 1 mm BGA and it works fine. We used it at 4 thou laser cut stencils when we had a manual stencil printer, but have moved to 5 thou with the DEK and it works ok. We originally went to 4 thou because of paste release, but the DEK
Electronics Forum | Fri Nov 20 01:00:50 EST 2015 | anilwagh
I am looking below parts of CP4-2. 1)1P150E-24-2 3)2MMB500U-01-1 3)3MMB50-4-1 4)4P300E-05-1 5)CACR-SR03BC IKS-Y264-1 6)CACR-SR10BC 1KS-Y262-1 7)CACR-SR44 BC 1BF-Y279-1
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
Electronics Forum | Thu Mar 21 03:07:04 EDT 2019 | pauljohnson
My friends said DH-A2 BGA rework station is stable and popular in Europe market. Does anyone know about it here? https://www.amazon.co.uk/dp/B07PX9HYYX/ref=sr_1_1?keywords=bga+machine&qid=1553151943&s=gateway&sr=8-1 https://www.youtube.com/watch?v=
Electronics Forum | Mon Apr 21 16:39:50 EDT 2003 | k_h
You might try reducing your solder paste volume. To much solder paste gives the part a pool to float in, nullifying the positive effect of surface tension. I use an aperture on stencil for the heat sink which is 5mils reduced on each side and a 25mil
