Electronics Forum: 10 (Page 1606 of 1930)

Tact Time Estimates

Electronics Forum | Mon Mar 10 19:01:32 EST 2003 | Stephen

This touches on one of my pet peeves. Management types demand something, that is not feasible or practicle. So the manufacturers put something together to pass off as what was asked for. In this case a way to put hard numbers on what a machine can

AOI, Pre or Post Reflow?

Electronics Forum | Wed Mar 12 09:18:10 EST 2003 | MA/NY DDave

Hi Thanks, Going to APEX to see personal demos and hear what they offer and recommend is a great idea. I mean if you want to put AOI everyplace I am sure you will be supported with open arms. What I found interesting in the article was that large

Print-Glue-Wave process

Electronics Forum | Tue Mar 11 10:19:00 EST 2003 | yngwie

We ran doublesided SMT thru Glue and Wave process before and but faced a lot of skip solder. Then the customer told us that they have similar problem when they ran the board so what they did was they print the paste-dispense the glue- place the comp

Moisture Sensitivity for Integrated Circuits

Electronics Forum | Thu Mar 20 16:59:10 EST 2003 | MA/NY DDave

Hi Read those guides again and then give IPC a call to see if they can direct you to any other materials. This stuff is quite old so they should have lots. The Mil does also. IPC does have a Designers Council that serves your area. Give the leaders

Shelf life of PCBs

Electronics Forum | Fri Mar 21 10:16:00 EST 2003 | O'Connor

Hi, Is there a standard that covers the shelf life of PCB's? I need to know, how long after manufacture a PCB can be stored in an uncontrolled envoirnment exposed to the atmosphere before being built on, currently we say 1 year, but nobody really kno

Solder paste change

Electronics Forum | Mon Mar 31 11:10:43 EST 2003 | davef

First, most �thermal shock� recipes are not a reliability test. There is no relationship between the failures seem in these tests and in-use application. These tests show you the failures in these tests. That�s it!!! Second, accelerated life test

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris

I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog

BGA Picture Evaluation

Electronics Forum | Wed Apr 09 13:30:20 EDT 2003 | davef

In order to get reliable reflow, you need to be at or higher than [liquidus + 20*C] for about 5 to 10 seconds. [I said 25* in a earlier post, but in an effort to stay on message, I'll stick with 20*] Don't forget that your liquidous is probably NOT

BGA Picture Evaluation

Electronics Forum | Thu Apr 10 19:21:02 EDT 2003 | tony_sauve

Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder joint temp's you need to have the thermocouple right at the ball/PCB interface. I'd recommend precision drilling a mechanical sample of the unpopulated P

BGA Rework

Electronics Forum | Thu Apr 10 03:29:16 EDT 2003 | emeto

Hi, that post sounds very bad.But I thing you shoul make an order for that problem.First the problem as I can see is not single.If I am right you should do exams step by step: 1.Design of the board-examine very carefuly(ask the manifacturer for help)


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