Electronics Forum: 10 (Page 1756 of 1930)

Re: Solder surface tension

Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian

| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |

Re: Solder surface tension

Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F

| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc

Re: Top Side BGA Reflowing @ Wave Solder

Electronics Forum | Mon Oct 11 08:34:52 EDT 1999 | C.K.

Thanks for the acvice, Dave and John. Like I stated above, I didn't feel comfortable with changing wave parameters since I knew that we'd be compromising our wave quality. I'll try the peelable mask thing, reprofile, and let you guys know what i fo

Re: high temperature solder alloy

Electronics Forum | Thu Oct 07 16:57:02 EDT 1999 | Glenn Robertson

| | I have a board, 4 spacers needed to be soldered on the board | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, there wi

Re: high temperature solder alloy

Electronics Forum | Fri Oct 08 08:26:03 EDT 1999 | Carol Zhang

| | | I have a board, 4 spacers needed to be soldered on the board | | | first with the normal 62Sn37Pb alloy. Then, capacitors are manually soldered on the boards. The density of the board is quite high. If we wave soldered capacitors first, ther

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F

| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Re: First Article

Electronics Forum | Wed Oct 06 15:29:24 EDT 1999 | Tony

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

Re: First Article

Electronics Forum | Thu Oct 07 03:19:33 EDT 1999 | Chris May

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

Re: First Article

Electronics Forum | Thu Oct 07 13:47:19 EDT 1999 | Doug Philbrick

| Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

Re: Losing parts in wave

Electronics Forum | Tue Oct 05 18:37:19 EDT 1999 | Morris

| I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Our


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