Electronics Forum: 100 (Page 106 of 309)

Solder Fillet on Gull Wing Lead

Electronics Forum | Wed Aug 15 05:19:14 EDT 2001 | hardy boy

Hi, I have a fine pitch QFP (TQFP100) and after reflow soldering, i got less solder ( not enough fillet) on the toe area but have good fillet at the heel. Does this mean that I have a weak solder joint or is my process not too good ? What is importa

loose component storage

Electronics Forum | Tue Nov 13 20:03:25 EST 2001 | davef

It is better than the divider try thing, especially if the divider try thing is not ESD protected. The repair person must req these parts or we end-up short on the build!!! Pissa!!! Howbout this? * Some repair companies sell kits / packets of re

intro to 2 sided assembly

Electronics Forum | Tue Dec 04 09:35:58 EST 2001 | jdill

I have successfully reflowed 208,100 pin QFP'S and SOJ 28's on the bottom side of the board. The only thing i am "SCARED" to reflow on the bottom side are BGA'S. We used to turn off the bottom heaters but we did a trial run with them off and the boa

Solder Paste Inspection System.

Electronics Forum | Mon Mar 11 04:25:49 EST 2002 | wbu

Don�t your recent findings on soldering defects point towards less need for AOI? Besides that, I imagine that with 100% control and having only good prints being processed while the bad ones getting washed and reprint you will see this magical 0%. Sh

Working Paste Before Printing

Electronics Forum | Mon Mar 18 20:49:46 EST 2002 | djarvis

We leave the next days quantity out overnight. Never had to do more than 4 kneads. On the inline we don't do any and the VMP 100s we only do one. Only seem to require kneading on the old clam shell printers - don't know why! That's with Indium SMQ 92

Profiling board

Electronics Forum | Thu Mar 28 10:11:00 EST 2002 | cyber_wolf

I use a .059" copper clad sheet of FR4 that I bought from one of our board houses. It has not started to delaminate yet, and it has been through our ovens several hundred times. I am not sure what the life expectancy of a thermo-couple is. I am not 1

High Aspect Ratio Via Fills

Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef

Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du

QP-132E // FCM 2

Electronics Forum | Mon Apr 22 08:48:27 EDT 2002 | Bob

The main reason I would choose a QP over 2 x CP6 is speed. Depending on optimisation you can get between 25 - 28 KCPH from each CP6 but with the QP1 you are looking at 75 - 100 KCPH, for much less line length. The QP1 is approx 1 x 1/3 the length on

QP-132E // FCM 2

Electronics Forum | Fri May 03 13:31:28 EDT 2002 | fastek

I agree with Sai regarding re-sale. It's night and day with Fuji vs. Philips. You can't imagine how cheap FCM-2's are going for these days. I've got a 2000 model with 200 hours on it (basically a new machine) and over 100 feeders available for very l

Baking Fine Pitch Components

Electronics Forum | Tue May 14 14:02:13 EDT 2002 | Hussman69

It all depends on the part you're cooking. Most components have a storage recommendation in their spec sheet. So be sure not to exceed it. Generally I see a lot of spec sheets that are arounf 140 C. So I set the oven for about 100 C and let it go


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