Electronics Forum | Thu Jun 13 14:41:40 EDT 2024 | tommy_magyar
Hi David, In one of my previous jobs I worked as an AOI/AXI process engineer and we had a set target of 75% FPY. This means that 75% of the boards at IPC Class 3 standards would not have a single false call. This also means you would need to set y
Electronics Forum | Fri Nov 12 13:07:45 EST 2010 | G8reflow
Hi, The focal point of my research has been to recommend a reflow oven and develop a process for a small to low-medium production SMT soldering with the following considerations. - Lead-Free - Low to low-medium production - Forced Convection reflow
Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory
Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W
Electronics Forum | Tue Mar 26 21:02:48 EST 2002 | Mike Konrad
There are two basic technologies to choose from: 1. Ultrasonic 2. Spray-in-air Makers of ultrasonic stencils include: Aqueous Technologies (that�s us): http://www.aqueoustech.com PMR: http://www.pmrsystems.com JNJ Industries: http://www.jnj-
Electronics Forum | Wed Jul 24 23:21:26 EDT 2002 | ppcbs
Being in the line of BGA rework and having performed much rework on boards that go into military planes, I can give you an opinion from a practical background rather than an in depth study. Basically BGA's have caused many of my customers big headac
Electronics Forum | Fri Jul 21 12:05:41 EDT 2006 | Chunks
Do the math first. 10,000 boards a month means 440 boards a day (roughly, and not including weekends). Do you plan 2 shifts or only one? If one, you need to produce a board about every minute if you work an 8 hour shift. If all 110 parts are on on
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
Electronics Forum | Tue Nov 17 09:24:24 EST 1998 | Earl Moon
| | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder
Electronics Forum | Wed Nov 18 21:58:17 EST 1998 | Dave F
| | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave sold
