Electronics Forum | Tue Sep 25 12:50:13 EDT 2001 | mparker
Since you are mostly concerned about the flux and suspect an application issue, you need to do a few things to validate whats going on. 1. Forget about speed of processing, length of time to do the job. Focus on accuracy first, then speed. with that
Electronics Forum | Wed Oct 03 09:26:19 EDT 2001 | davef
Whether the customer is from a large or small corporation, military or commercial, the majority of our data comes in RS274X. In theory, ODB++ seems like a good idea. It may take some time for it to actually get into the mainstream where we are. It
Electronics Forum | Wed Oct 10 20:35:17 EDT 2001 | djarvis
Stephen, I don't understand this at all mate. 1. If you don't place a QFP and get bridging across the bare pads, you were gonna get absolutely horrendous bridging if you did put one down. That points to poor printer set up or stencil design or both
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Wed Oct 17 17:43:27 EDT 2001 | davef
2) Open time: A 15-minute queue between paste, place, and reflow SB fine, assuming humidity is not too great. 3) Wash temperature: Yes. A wash temperature of 130-140�F SB fine. 4) Reflowed board was left too long prior wash: Are you washing: * After
Electronics Forum | Fri Oct 26 11:34:44 EDT 2001 | pteerink
Paul, Many variables that affect changeover, here's a few to start with: 1) Feeder count- do you have enough feeders to be able to do a complete setup off-line? Take your product that uses the most amount of feeders, and make sure you have at least
Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Wed Nov 14 20:30:26 EST 2001 | davef
Tks. So was the answer that you got close? [ala "Car Talk"] Some guy from Cal-fornie sends me spill. I get cigars from � Yeh, I know I hog the responses, but I learn by doing this. If I can communicate in print, I can better communicate in word
