Electronics Forum | Mon Jul 24 11:10:38 EDT 2000 | Sal
we have just started manufacturing a board which has surface mount components on side 1 and on side 2 all the thro hole components are d type connectors, (loads of them) the chances of these connectors inserted with the wrong orientation is very, ver
Electronics Forum | Wed Jul 12 14:14:17 EDT 2000 | celiav
I have 2 contract manufacturers who have recently switched to immersion tin and both are experiencing problems. One supplier is having problems reflowing the solder in the oven, while the other is having insufficient hole fill at wave solder. Both ha
Electronics Forum | Wed Jul 12 16:33:39 EDT 2000 | Mark Charlton
We just went through a difficult time processing SMT immersion white tins PCA's and found the following: 1. FAB vendor had a degraded tin solution resulting in improper plating thickness 2. FAB vendor was not using the proper cleaning process Get
Electronics Forum | Wed Jul 12 01:48:45 EDT 2000 | Zhang JianJun
There are two kinds of automatic inspection equipment was used in our company in China. One is MVT GS-1 another one is VI2000. We put it in line before reflow oven for quality control. It's very useful and average 1-2 DPHU reduction compare with non
Electronics Forum | Mon Jul 10 15:13:56 EDT 2000 | Mark Charlton
I know it's been brought up a thousand times before but after an hour of searching the archives I'm taking a short-cut. When processing one side of a double-sided assembly with adhesive, should the adhesive side be processed first or should "side" c
Electronics Forum | Tue Jul 11 11:35:03 EDT 2000 | genglish
John, Dave. The adhesive deposition is on the second pass through the SMT area, the PTH components have previously been fitted during the axial / radial stages of manufacture. The stencil is 2mm thick with a 1.5 mm routing depth. the leads (cut & cl
Electronics Forum | Wed Jun 28 07:45:39 EDT 2000 | Wolfgang Busko
Hi Allan, I can�t help with literature on that topic but we have great success with solder thiefs to prevent bridging with 2mm pitch THT-connector. We added just blind pads of the same size at the end of each row similar to what you can do with SMD
Electronics Forum | Sun Jun 25 00:33:13 EDT 2000 | Robertsam
I had problembs with taping the signal to on the buzzer with machine tower light.However I try to connect parrallel to the light but the control board which connected to the light malfunction after 1/2 hour.The tower light is trigger by the ground s
Electronics Forum | Fri Jun 23 10:01:35 EDT 2000 | Bob Willis
A couple of weeks back I produced a video clip for Metcal to show what happens when BGA pop or the edge of the base warps causing shorts to form. Its 2.3meg if there is enough interest in seeing this I will put it up some where for download. Bob Wil
Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou
Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's
