Electronics Forum: 2.. (Page 416 of 1152)

Immersion Tin

Electronics Forum | Wed Jul 12 14:14:17 EDT 2000 | celiav

I have 2 contract manufacturers who have recently switched to immersion tin and both are experiencing problems. One supplier is having problems reflowing the solder in the oven, while the other is having insufficient hole fill at wave solder. Both ha

Re: Immersion Tin

Electronics Forum | Wed Jul 12 16:33:39 EDT 2000 | Mark Charlton

We just went through a difficult time processing SMT immersion white tins PCA's and found the following: 1. FAB vendor had a degraded tin solution resulting in improper plating thickness 2. FAB vendor was not using the proper cleaning process Get

Re: Automatic Inspection Equipment

Electronics Forum | Wed Jul 12 01:48:45 EDT 2000 | Zhang JianJun

There are two kinds of automatic inspection equipment was used in our company in China. One is MVT GS-1 another one is VI2000. We put it in line before reflow oven for quality control. It's very useful and average 1-2 DPHU reduction compare with non

2-sided Process

Electronics Forum | Mon Jul 10 15:13:56 EDT 2000 | Mark Charlton

I know it's been brought up a thousand times before but after an hour of searching the archives I'm taking a short-cut. When processing one side of a double-sided assembly with adhesive, should the adhesive side be processed first or should "side" c

Re: Adhesive Stencils

Electronics Forum | Tue Jul 11 11:35:03 EDT 2000 | genglish

John, Dave. The adhesive deposition is on the second pass through the SMT area, the PTH components have previously been fitted during the axial / radial stages of manufacture. The stencil is 2mm thick with a 1.5 mm routing depth. the leads (cut & cl

Re: Wave Solder Land Patterns

Electronics Forum | Wed Jun 28 07:45:39 EDT 2000 | Wolfgang Busko

Hi Allan, I can�t help with literature on that topic but we have great success with solder thiefs to prevent bridging with 2mm pitch THT-connector. We added just blind pads of the same size at the end of each row similar to what you can do with SMD

Tapping

Electronics Forum | Sun Jun 25 00:33:13 EDT 2000 | Robertsam

I had problembs with taping the signal to on the buzzer with machine tower light.However I try to connect parrallel to the light but the control board which connected to the light malfunction after 1/2 hour.The tower light is trigger by the ground s

Re: Shorts in corners of BGA devices

Electronics Forum | Fri Jun 23 10:01:35 EDT 2000 | Bob Willis

A couple of weeks back I produced a video clip for Metcal to show what happens when BGA pop or the edge of the base warps causing shorts to form. Its 2.3meg if there is enough interest in seeing this I will put it up some where for download. Bob Wil

applying DOE to SMT process

Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou

Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's

SMT coil placement

Electronics Forum | Fri Jun 16 14:24:44 EDT 2000 | Roisin

I am looking for information regarding SMT coil placement for coils with between 2 and 6 turns. If anyone has any experience with this, I am interested in finding out about the problems that were encountered, what type of placement equipment was suc


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