Electronics Forum: 2.. (Page 861 of 1152)

Warming up solder paste at start of days production

Electronics Forum | Thu Jul 22 07:52:37 EDT 2004 | Chris L.

Hi Grant, The purpose for allowing the solder paste to reach room temp before production is to reduce the amount of water absobtion from the air. (e.g. a cold glass of water "sweats" on a humid day)The purpose for mixing is to make the viscosity more

Warming up solder paste at start of days production

Electronics Forum | Sat Jul 24 11:57:50 EDT 2004 | KEN

I wonder what that would look like? BUILD DCOUMENTATION Paste: OA XYZ-123 SOLDER PASTE. Note: Place refridgerated paste tube in Goldstar Microwave (3rd from the end of the break-room). Press "defrost" "forzen dinner". Do not defrost solder paste

Warming up solder paste at start of days production

Electronics Forum | Mon Jul 26 06:32:58 EDT 2004 | cyber_wolf

Grant, The only thing that you really gain from refrigeration is a couple more months� shelf life. Refrigeration also seems to slow down flux separation. I am not sure how your paste consumption is, but we use ours up way before the expiration date

Warming up solder paste at start of days production

Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN

Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili

Can excessive reflow(longer dwell time) cause open joint?

Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W

hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c

SMT Machines

Electronics Forum | Fri Jul 30 04:09:02 EDT 2004 | vinitverma

I would highly recommend Assembleon OpalXII/TopazXII for your low volume high mix applications. You could perform changeovers very quickly. Of course it depends on how many feeders are required per product. If you buy for example, 2 OpalXII machines

Pick Up Error

Electronics Forum | Thu Aug 05 20:33:48 EDT 2004 | Dhanish

The machine type is Fuji CP6.We have major issues with Network Resistor placement.The equipment guys often feedback there is a problem with nozzle and feeders.What will happened to the part if the Thickness data in the Part Data does not match the Pa

Solder balls - Pb wave soldering

Electronics Forum | Thu Aug 12 13:34:03 EDT 2004 | gregoryyork

Yes unfortunately solder resist again, getting boring I know. That green stuff on the boards causes all kinds of problems if not applied correctly. Can't blame the flux (as usual) or the process as he has tried all varients to no avail and therosin s

soft gold vs immersion gold

Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef

As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned

Calibration of feeders

Electronics Forum | Tue Aug 17 08:36:01 EDT 2004 | rlackey

CP6/7 feeders are mechanical indexing machines, and the springs, cams etc wear over time leading to misfeeds & increased attrition. You can just strip & repair but especially on the 8x2 feeders the pick up position is critical. John, I'd check with


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