Electronics Forum: 2000 (Page 401 of 506)

Re: Process Characterisation

Electronics Forum | Thu Nov 30 13:51:33 EST 2000 | Michael Parker

Thanks for the details. Next question- where is your first time pass rate measured? Is this at test? Do you have inspection gates at the end of each process step? To get to the root cause, you need the earliest detection. Collect attribute data by a

Re: Process Characterisation

Electronics Forum | Sat Dec 02 21:21:11 EST 2000 | Murad Kurwa

Our NPI division is in a same category. We assemble small quantities and lot of different set-ups. I created a DPMO charting method using Excel that we use at Post Reflow, Post Wave and Final QC. In addition, we use x-r charts at screen print for con

Re: Siemens HS50 and F5 and S25

Electronics Forum | Tue Nov 28 16:28:14 EST 2000 | CAL

Chris- The machines you identified are stable products and have been around for over two years now and most bugs have been worked out. The F5 IC head has not changed much since its introduction over 5 years ago. Remember these machine like to run, r

Black spot on Gold Pads

Electronics Forum | Sat Nov 25 18:45:19 EST 2000 | Ashok Dhawan

I am getting black spots / stuff while I run gold finish PCB through reflow soldering process using NC solder paste.The affected spots have intermetalic as black in color. Does not solder very well. I did look at the archieve but could not find info

conformal coating selection

Electronics Forum | Thu Nov 23 23:59:25 EST 2000 | terry sun

Hello to all out there, We're considering CC process,and would like to know some defferences between SSC3 of Electrolube and Humiseal 1B73, yes,I know that SSC3 is silicone one,and Humiseal 1B73 is solvent based acrylic as well as other basic propert

Re: conformal coating selection

Electronics Forum | Tue Nov 28 13:21:33 EST 2000 | Graham Naisbitt

Terry The SCC3 product is a vinyl modified silicone. It is less able to perform at low temps as it becomes brittle. It is not easy to repair because it is essentially silicone. It is not a qualified material to the MIL-I-46058 Spec. Are you sure yo

Re: Humidity Control

Electronics Forum | Fri Nov 24 07:28:01 EST 2000 | Chris May

Victor, I am wondering why you are keeping the RH as low as 32% ?? The lower you go, the higher your ESD problems will be. The voltages generated at about 40% are roughly halved when you reach 55% I believe that an acceptable level is about 55%-65

Re: BGA Rework station

Electronics Forum | Wed Nov 22 15:09:52 EST 2000 | Finepitch Services

Chryzs, I've used AIRVAC and SRT (with their old adjustable 4 piece nozzle system). I also saw the APE Chipmaster... Here's my 2C after all that: Whoever claims he/she has a user friendly system is a big liar. The words are correct but the order is

Re: Solder paste recovery

Electronics Forum | Tue Nov 28 18:10:13 EST 2000 | Michael Parker

Norman- I would be pushing to get the real world to match the ideal world, in other words get your jobsetters to do the right thing. You are looking to incur more costs to justify not having to make people do their job right. A bit of training a

Re: Solder paste recovery

Electronics Forum | Wed Nov 29 10:50:24 EST 2000 | blnorman

Vacuum casting (same process used to make solid rocket motors) should remove any air from the paste. We had thought of pressurizing the tubes to remove the residual paste, but that would entrap air. The problem of tubes sitting out for different


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