Electronics Forum: 2001 (Page 161 of 378)

Wavesoldering

Electronics Forum | Thu Mar 15 21:29:06 EST 2001 | davef

That you can solder the test points with a little extra flux and a good blast of heat makes me think there is nothing fundamentally wrong. I'd guess there is oxidation on some test points that is a little crustier than others. You might be able t

Need Expert Support

Electronics Forum | Thu Mar 15 08:25:12 EST 2001 | Glenn Dody

I am currently in San Jose working on a BGA assembly problem in a customers subcontract house. I do consulting in this exact kind of work with years of experience trouble shooting PC board assembly problems especially with BGAs. I am booked up unti

Bottom side process question

Electronics Forum | Wed Mar 14 17:33:42 EST 2001 | davef

Check Bob Willis' site. He calls this Single Side Multipass Endothermic Elongated Happy Reflow Soldering, er someting like that. Ha ha ha!!! Naw, he calls it Simultaneous Double-Sided Reflow Soldering. That might be something like you are talking

Bottom side process question

Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef

Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles

Bottom side process question

Electronics Forum | Thu Mar 15 16:58:11 EST 2001 | mparker

The only way I know of waving the bottom side with SMT parts installed without epoxy would be to use a masking media, Kapton Tape, wave pallet that keeps those parts from being susceptible to gravity once the connections are reflowed. If there is ano

Bottom side process question

Electronics Forum | Fri Mar 16 17:50:45 EST 2001 | djarvis

Steve, I did this several years ago on a terribly designed board that left a lot of joints unsoldered after the wave. It works OK. This was a bog Irish board with nothing fancier than SOP packages. Glue was Amicon D125. Happy St. Patrick's Day everyo

Paste life span on the printer

Electronics Forum | Wed Mar 14 02:04:40 EST 2001 | pjc

zam, each paste mfg. has different "stencil life" times. check w/ your paste mfg's specification for stencil life. also, temp and humidity inside the printer's chamber effects "stencil life" time. we keep ours around 20C @ 50% RH. higher temps and l

BGA X-Ray inspection question

Electronics Forum | Wed Mar 14 14:03:19 EST 2001 | mzaboogie

Hello, I have been told to look for open BGA connections, the open ball would appear larger than the others due to the fact that it has not columnized. I have also been told that it will look smaller due to the fact that it has not collapsed. Could

seeking better process

Electronics Forum | Wed Mar 21 12:42:50 EST 2001 | raton

Dave, always a breath of fresh air! But wait, you're talking 'em out of being a manufacturing OEM. Don't do that, they are already a dying breed, and we need more of 'em. (OEM's are usually better to work for than the contract shops) Good overvie

seeking better process

Electronics Forum | Mon Apr 02 01:07:26 EDT 2001 | Dreamsniper

Hi Ed, Identify what equipment you really need as there are a hell of equipment in the market that would suit your desired throughput. Before buying or investing on capital equipment, calculate your expected ROI. Also don't forget to include the fut


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