Electronics Forum | Thu May 30 10:45:16 EDT 2002 | sjpence
We got a similar alloy Sn05Pb93.5Ag1.5, of Alpha Vaculoy bars. It is not the eutectic alloy you were looking for but it is close. This alloy and similar high temperature alloys are used in downhole electronics and so a supplier in the Houston area
Electronics Forum | Wed May 29 12:41:46 EDT 2002 | peterson
I'm out here on the leftcoast. Actually, our method for removal is: break down the sides, pull each pin individually. It's tedious and time consuming, but it can be accomplished with little risk of damaging the board. Customers are curious, however.
Electronics Forum | Wed May 29 19:00:08 EDT 2002 | russ
Have been seeing a pretty fair amount ourselfs. it seems to come and go. Couple of questions 1. Are the parts shifting to one side during reflow? 2. is it true non wetting to the component? I have been experimenting with different pad geometries a
Electronics Forum | Fri May 31 14:36:12 EDT 2002 | russ
does anybody have any info on what the minimum kV power should be on an X-Ray machine to handle general BGA inspection? I have heard that you need a minimum of 100 kV for the Metal top packages but have also heard of people using 50-60 kV but I don't
Electronics Forum | Fri May 31 16:36:57 EDT 2002 | davef
If you know about 'BIG DADDY', you know what I know. A nearby thread [ http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=2&Thread_ID=1678&mc=2&forum_idx=40 ] addressed your question more directly, but certainly didn't drill-down t
Electronics Forum | Tue Jun 04 17:21:22 EDT 2002 | jasonfang
I found solderballs are around chip components (on one side of middle area), I checked gerber data, solder paste of aperture on the stencil for these chip components have 5% reduction to solder land on PCB, shape of solder land are square, not home p
Electronics Forum | Thu Jun 06 15:55:28 EDT 2002 | arzu
I agree with the others and experienced the problem myself this week. Solderballs at the side of the chips. I looked at the board and found that the chip is pressing the paste away too much. This in combination with our quite big pads(and stencilaper
Electronics Forum | Tue Jun 04 16:12:41 EDT 2002 | Bob
The original profile had a higher ramp rate, and the apertures were 100%. The ramp rate is now much gentler and the addition of a small soak area around 160 � 170 degrees should burn off any excess flux. Appertures are now smaller and we get no leac
Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef
Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula
Electronics Forum | Wed Jun 05 12:22:45 EDT 2002 | Bob
No. Placement force is fine. Also boards have been inspected prior to reflow using microscope with no evidance of misplaced solder balls. The ramp rate has been reduced to acceptable limits, typically .8 - 1.5 degrees per sec. Outgassing from eithe
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