Electronics Forum | Mon Jul 01 21:25:14 EDT 2002 | jersbo
Have... Topaz and Emerald X inline (GEM series) very satisfied with thru-put and quality.. as well as tech support... have worked with other machines as well Fuji(3,4) Universal GSM series... and Europlacer(Multitronic) Best software goes to Univers
Electronics Forum | Thu Jun 13 21:44:21 EDT 2002 | jkhiew
Hi all, * Defect : termial to terminal touching btw two melfs body that created short circuit. * Clearance : 0.8mm btw two melfs body. * Size melf : diameter=2.4mm to 2.7mm, length=4.8mm to 5.2mm * Stencil opening : "v" shaped to minimise component
Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef
Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because
Electronics Forum | Mon Jun 17 17:04:15 EDT 2002 | pjc
Guys, Thanks for the input. Its a Opto-Electronic project I'm working on for a customer with a device on a ceramic substrate. Yes, I did learn from Indium that 007 is no-clean and has a high-solids content. They reccommended using TacFlux 010, which
Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax
On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c
Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Thu Jun 20 15:05:41 EDT 2002 | carln
I saw this system at one of the last APEX Shows. I was not impressed because of the many downsides and potential hazards. Strapping an electrical device on your hand and placing the device into a liquid is kind of like blow-drying your hair in a ba
Electronics Forum | Fri Jun 21 10:22:13 EDT 2002 | russ
A lot of your success with waving SMT components is dependent upon design and what type of wave forms you use. Without knowing how the board is laid out or what type of wave you have it is pretty difficult to determine what the yield differences wil
