Electronics Forum | Thu Aug 28 11:13:53 EDT 2008 | janz
Have you tried to run the same process but with diffrent solder paste manufacturer.? This give you information whether paste is ok. Try also print paste on the bare board and run through reflow oven. Check 2-3 boards. Is it the same places where i
Electronics Forum | Mon Aug 25 16:48:14 EDT 2008 | petep
Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"? Like all of you, we build, profile place and solder for reliability, but the time will come when one of these co
Electronics Forum | Tue Sep 02 12:49:07 EDT 2008 | markhoch
Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA rework station. Clean up the part and PCB by carefully removing extraneous solder, paste the PCB, (or the bottomside of the LGA itself) and replace. Ref
Electronics Forum | Thu Sep 11 11:47:15 EDT 2008 | jeffcali
Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot air machine. Some places don't have the money to spend on mini micro stencils of all types, and thus spend the money on various sizes of solder balls
Electronics Forum | Wed Aug 27 09:35:38 EDT 2008 | vladig
Hi Omid, Before tweaking the profile, it's a good idea to figure out why the devices were not soldered. It well could be that there is a problem with their finish, so changing the profile might not help. That is what our cutomers ask us to do if the
Electronics Forum | Fri Aug 29 07:22:05 EDT 2008 | realchunks
Omid, Try changing your profile. I had the exact same thing happen to me in 2006. Eventually I had to change my paste. No lead parts can and DO have a different finish that Pb parts. Why do you think the rest of the world increased their oven te
Electronics Forum | Sun Aug 31 07:13:13 EDT 2008 | allan99
All that they are telling is important (variants in the process), what you can do in a fast way is: change the component for a new one (date of manufacture / other supply - if you have); change the component (test - same package but other specificati
Electronics Forum | Mon Sep 01 09:49:54 EDT 2008 | allan99
I told a friend this problem, and he also thinks the problem is the component, and suggested a different solder paste (more acid), maybe you can ask your supplier for a sample and orientation. Until there I think you have to rework if its only one co
Electronics Forum | Mon Sep 01 12:37:52 EDT 2008 | vladig
I would do just that (and eventually will), but I've been just trying to give "free advices" so to say. What I've been suggesting is a typical way to solve a manufacturing problem. Please let me knw if you think I'm confused. Regards, Vlad
Electronics Forum | Wed Sep 03 17:09:23 EDT 2008 | glennster
Omid, In some cases we have been able to restore acceptable solderability by dipping the leads (one side at a time) in an active flux and then re-tinning. Usually a good visual inspection after tinning would reveal whether this was going to work.
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