Electronics Forum | Sat Aug 30 11:42:49 EDT 2008 | davef
Some immersion silver [IAg] products can go brown with aging. On a newly plated board, we expect you to see Ag, C, & O. The amount will vary according to supplier and thickness. Questions are: * How uniform is the brown coloration of the IAg on the
Electronics Forum | Wed Sep 03 07:39:19 EDT 2008 | pjc
You may not be getting enough exhaust pull, so the cooling modules over temp. Try swapping blower motors to isolate that before buying one. STANDARD AIR OPERATION: - Load-end: 150 cfm (255 m3/hr) at the 4� (102 mm) stack (minimum requirement) - Unlo
Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster
At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera
Electronics Forum | Wed Sep 10 07:42:52 EDT 2008 | lloyd
Can you provide a bit more info on your machine setup. I not full fimilar with the S-27 so a few points may not be relevant to your machine. Are you using Siplace Pro. Are you using the standard GF for the 0201 component. Do you have the component
Electronics Forum | Thu Sep 04 14:39:35 EDT 2008 | bschreiber
Jim, There are several articles on Misprint cleaning at http://www.smartsonic.com/article.html including the "Stencil and Misprint Cleaning Handbook" by the IPC. Real Chunks, We have replaced several pneumatic stencil cleaners over the years that we
Electronics Forum | Mon Sep 08 08:59:45 EDT 2008 | davef
You're correct: * Sealed relays should not be cracked or have moisture intrusion. * Hand soldering relays is going to be expensive. [Using a mini-solder pot for this might reduce some of the burden.] The good part is that the problem is gross enough
Electronics Forum | Mon Sep 08 01:45:35 EDT 2008 | rameshr
1.The Temperature on the pad is 247.C & also it is an lead free profile, the same profile we have used till last lot but we had obsereved this problem earlier to this current batch. 2. Both in Type3 & Type 4 paste we are using because of we are using
Electronics Forum | Wed Sep 10 12:20:52 EDT 2008 | grics
True words of wisdom. Production managers need product out the door, not tied up in wip waiting on an analysis to go and fight a vendor for errors in their manufacturing. Especially if you are a Low Vol High Mix facility. Quite frankly, the resourc
Electronics Forum | Wed Sep 10 12:56:26 EDT 2008 | vladig
No arguments there. I 100% agree that quality engineers can and do solve a lot of problems on the spot. I've nevern said "run an analysis as soon as you get a problem". The whole nine yard started with a solderability problem. In my previous product
Electronics Forum | Thu Sep 11 09:59:47 EDT 2008 | rarnold
Paste stored tip down, so separation in the tube is not suspect. Remember that the defect was produced on a screen printer running with a Rheopump. A few more details are that the strip of the board containing the uncoalesced solder is consistent w
