Electronics Forum | Fri Apr 13 05:59:58 EDT 2001 | zam_bri
I�ve just had an argument with my Boss on the frequency of Stencil cleaning. He told me to remove the procedures that asking the operator to send the Stencil for cleaning ( using Automatic machine ) after every 8 hours. I said big NO!! NO!!. He said
Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
Electronics Forum | Fri May 04 12:28:12 EDT 2001 | slthomas
We have had some success printing 20mil pitch with our IIT Proframe. It takes some babysitting, and you don't want your operators to be changing these things out every hour or you'll be buying lots of them. Pulling tension in one direction gives r
Electronics Forum | Tue May 29 16:53:20 EDT 2001 | pcmarch
The most current Amistar models prior to Tenyru being sold were the 7100 series. This is very similar to the current I-Pulse equipment. Before that, there was the 5800 (4 heads all vision) 5720Z (3 mechanical heads, 1 vision to 20mil) and the 5630
Electronics Forum | Fri Jan 14 10:11:45 EST 2000 | John Thorup
I'll have to go along with Wolfgang as having a good experiance with frameless. We have been using a system from IIT in California for about a year. I was sceptical at first because of this system's X only tensioning but it does work. We use mostl
Electronics Forum | Thu Jan 06 01:55:01 EST 2000 | Roni Haviv
From my experience: It's depends on your messurment tools and the component: - Average high (at least 3 messurment points) should be 6 mils max. (you'll always get pick points of 4-7 mils!). - It depends on component tech./pitch: in pitches great
Electronics Forum | Tue Sep 21 11:28:26 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Sep 21 13:43:33 EDT 1999 | Glenn Robertson
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Sun Sep 12 09:40:04 EDT 1999 | Wayne S.
hello having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would they do that
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
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