Electronics Forum | Thu Apr 26 20:18:45 EDT 2007 | hegemon
For what it is worth, we are purchasing a dispensing system including a Robotic Arm, Positive Displacement Valve (as opposed to volumetric displacement) and Controller. We have purchased this unit for doing lead free 20 mil dots at 30 mil pitch in s
Electronics Forum | Wed Jul 09 14:47:39 EDT 2014 | deanm
I'm looking for a typical SMT placement defect rate from others in the field so I can judge whether or not we are in an acceptable range. If I give you a board with 200 components (0603, 0805, SOICs, 20mil MSOPs, tantalums, DPAKs and a few 20mil fin
Electronics Forum | Thu May 03 18:40:34 EDT 2001 | pzohbon
We produce a board right now with a QFP that has 20 mil pitch and we are seeing problems with the solder deposition. I believe it to be a cleaning issue which we are addressing. Soon we will be pasting for bga's. Is there a problem with using inter
Electronics Forum | Sun Jun 10 11:08:26 EDT 2001 | nifhail
I know that there is no pre-defined strength for the solder joint as it will depend on solder volume deposited, pad geometry, lead component's lead solderability etc. but, what would be the best ball park for the good joint for 0402, 0603, 20 mil pti
Electronics Forum | Tue Feb 01 06:54:19 EST 2000 | Roni H.
Hi, Does anyone have experience with gold over nickel (electroless) PCB finish: - Repeatble quality from PCB mfg. (very "painfull" with ENTEK). - Environment condition sensitivity. - Thermal processes sensitivity. - Solderability (Reflow & wave). -
Electronics Forum | Sat Nov 06 14:39:50 EST 1999 | Gary Moravchik
I am seeking sources of reliability and thermal stress data that compares BGA (50mil ball pitch) to QFP (20mil lead pitch)packaging for automative applications. Substrate material is epoxy glass. The ultimate goal is to collect sufficient data to hel
Electronics Forum | Wed Oct 27 16:16:24 EDT 1999 | John Thorup
Hi Dave I have used the IIT proframe II (I believe the proframe I used four sided tensioning, was somewhat inconvenient to set up and is obsolete) for about six months. I don't have any complaints of note and I do use it to 20 mil. It does take som
Electronics Forum | Mon Oct 25 15:23:26 EDT 1999 | Dave F
Ron: You're really talking about a step-up stencil in the area of the BGA. I don't think your problem is a lack of solder, but who know? I think you should do some sections on returned boards from your customer to help determine the source of the
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Wed Jun 09 12:20:26 EDT 1999 | Gang Pan
I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. There is anybody has experience on metal-based PCB reflow process? I guess pre
