Electronics Forum | Wed Mar 28 03:32:33 EDT 2018 | reckless
So I found an early model samsung sm320 for under $20k BUT it needs a new motor and has 15,000 hours (not sure what life of one of these is but hardly seen a Samsung with 20,000 hours). The Juki 750 was highly recommended and its under $10k with fe
Electronics Forum | Thu Nov 20 16:51:48 EST 2014 | joe98375
gregp: Our PTH process has not changed in many years. Our products are fairly simple as far as electronics goes and everything gets potted anyways. ~90% of everything we build is single sided TH with ~ 100 solder joints per board. Each board is ~
Electronics Forum | Wed Mar 08 14:11:38 EST 2006 | mholz
I am looking for an industry standard �stock� note to place on our printed circuit board assembly drawings that will capture a level of cleanliness for an IPC-A-610 class 2 board assembly. I�m looking for some quantitative spec for cleanliness that w
Electronics Forum | Mon Oct 21 13:40:05 EDT 2002 | slthomas
Is it safe to use the 100M ohm value found in Table 2 of J-STD-004 as a minimum for SIR with respect to flux specification acceptability? It (J4) appears to imply that that value provides some level of acceptability, but it just doesn't come right o
Electronics Forum | Wed Aug 04 16:09:48 EDT 2004 | Dreamsniper
Hi, Thanks for your reply. I run 2 boards, using the same paste, thermal profile and the same method of aqueous cleaning, 1st is a Topline test board with topline BGA (BGA 272 with 1.27 Pitch) and the 2nd is our product PCB with our BGA from Motoro
Electronics Forum | Wed Nov 03 14:46:29 EST 2004 | dramos1
Hi Russ, Thanks for the reply. In IPC-A-610 Rev. C on section 5.2.9 {Mounting - Connectors] page 5-21 on the manual [January 2000], the acceptable class [1,2,3]listed 3 items. In order for the connector to be accepted, are all 3 items must be met? I
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj
BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >
Electronics Forum | Mon Feb 20 15:28:15 EST 2017 | fuzz
Hi guys. I'm dealing with 3 MPM Ultraprint 3000 machines in our plant that were showing different issues. I managed to solve most of them but one is killing me and I can't seem to solve it. It's a 3000 HiE model... Basically, the machine seems to be
Electronics Forum | Mon Nov 13 13:26:43 EST 2017 | rcooley4
Hi all, I'm in the market for a BGA rework machine capable of handling a wide range of PCB's, anything from little 2"X2" board up to 15"X15" back-plane boards that are 0.100" thick. I would like to find a machine that can remove BGA's & QFN's, clean
Electronics Forum | Thu Apr 14 13:49:34 EDT 2022 | winston_one
Thank you for reply, Stephen. No, As I wrote it was leaded process. I heard that it is possible with lead free solder at higher temps an dwell time. At NPL Defect Database I've find this case wich looks exactly the same: http://defectsdatabase.npl.co
