Electronics Forum | Thu Nov 14 18:51:08 EST 2013 | tombstonesmt
We use a 2mm with our Pillarhouse Jade Mark II. We found that reducing the nitrogen enough that the area around the nozzle stays hot enough not to "freeze".
Electronics Forum | Fri Sep 21 16:04:48 EDT 2018 | gpascolla
We have an old juki 740 which was purchased off of eBay at this time I am having placement problems with accuracy. I have taught to the board with the camera numerous times but I still have placement problems where the chip will be off the pad by alm
Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Thu Jan 30 07:19:23 EST 2020 | dontfeedphils
I'd post an image of your current profile if you could. Have you tried a RTS profile instead of a RSS?
Electronics Forum | Fri Jan 31 00:20:47 EST 2020 | jineshjpr
Thanks for your response, yet to try with RTS Solder profiles, Have you any additional comments on this RTS Temperature specifications like Time above liquidus, Peak temperature if any..??
Electronics Forum | Fri Jan 31 00:21:28 EST 2020 | jineshjpr
Thanks for your response, attaching the solder profile for your verification. The part NXP Make PCA2002 Micro BGA 8Ball Package.
Electronics Forum | Thu Apr 30 23:21:52 EDT 2020 | SMTA-Davandran
I am seeing a lot of solder ball for PIP process. is it due to the paste height go beyond 0.2mm.? what is the DOE need to focused for PIP process?
Electronics Forum | Tue Aug 04 04:20:36 EDT 2020 | bangir
Hi Chris, It's arround +/- 2MM. There was a gap if running pcb with thickness 1MM. The PCB position below the rail table.
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