Electronics Forum | Wed Aug 06 17:45:54 EDT 2014 | rangarajd
Hello: Does any one have a soft copy of AMS 3.0 manual?
Electronics Forum | Tue Sep 19 15:11:16 EDT 2006 | d0min0
Hi there, we use inertec els 3.0 and 4.0 machines regards
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
Electronics Forum | Wed Sep 18 15:13:17 EDT 2002 | davef
Effects of Gold (Au) on Solder Properties Concentration Range in Weight Percentage w/o Au in Sn63/Pb37 Solder [A Sugarman/Loranger] * 2.0 - 3.0% Spreadability and fluidity of solder reduced (1) * 3.0% Highest acceptable concentration of Au in solder
Electronics Forum | Tue Nov 11 14:33:12 EST 2014 | rangarajd
Hello, I'm currently using the AMS 3.0 Build 30068 software to program my assembleon MG1R and Topaz XII's. The software is currently running on XP and would like to upgrade the OS to win 7 or 8. Is anyone successfully running a newer version of AMS
Electronics Forum | Thu Dec 16 16:28:51 EST 2004 | Indy
Hi, We are using Sn/3.0Ag/0.5Cu solder paste on Pd/Ag pad metallization in one of our application. Could someone provide me information on the following: 1. How bad is the Leaching of Ag in SAC alloy and how it can be mitigated. 2. During reflow so
Electronics Forum | Thu May 31 21:45:48 EDT 2012 | davef
rsthompson ... if you're talking about bare boards IPC-5701, Users Guide for Cleanliness of Unpopulated PBC, Table 8 ||Bare board final surface finish Ions||Hot air solder level||OSP over copper||Gold over nickel Chloride||0.75 ug/cm^2||0.75 ug/cm^2
Electronics Forum | Wed Nov 08 08:12:16 EST 2006 | jnaligan
hi... try evaluating eco solder paste Sn96.5/Ag3.0/Cu0.5 from Senju... output is good and i suggest your stencil's apperture ratio with the pad 1:1 when it comes to fine pitches...and BGA pads regards, janry
Electronics Forum | Wed Jun 27 11:59:55 EDT 2007 | samir
*Preheat zone *Maximum slope is a time/temperature relationship that measures how fast the temperature on the printed circuit board changes. The ramp�up rate is usually somewhere between 1.0 �C and 3.0 �C per second, often falling between 2.0 �C and
Electronics Forum | Mon Mar 26 10:40:14 EDT 2007 | solderiron
WaveroomPlus can offer the following Sn95.5 Ag3 Cu0.7 Sn95.5 Ag4 Cu0.5 Sn96.5 Ag3.0 Cu0.5 Sn97 Ag2.5 Cu0.5 Steve@waveroomplus.com
