Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Sat Jan 06 10:52:09 EST 2001 | Steve Thomas
I don't know the specs. of our MSHII's, as I'm sort of detached from that part of the process, but supposedly they are capable. Panasonic also recommends we buy all new feeders (well, big surprise there), because of the risks involved with retrofitti
Electronics Forum | Wed Oct 11 10:29:28 EDT 2000 | G. English
Try the following steps : FIRST CHECK THE ARCHIVE for further information, it WILL help you. Step One : What�s the chemical analysis of this white res? Obtain a sample. It could be tin, rosin, or something else??? Step Two : The fastest way I know
Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Mon Nov 15 21:32:31 EST 1999 | Dave F
Wolfgang: Sounds like gluteus maximus protection time. 1 "Maximum suitable temperature for the solder joint should be half the liquidous temperature" is a good rule of thumb. Where it came from, I don�t know. One place I�ve seen it repeated is: H
Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian
Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur
Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.
I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about
Electronics Forum | Thu Jan 14 11:06:33 EST 1999 | Earl Moon
| | Some of my friends ask me if sombody use lead free solder ball on BGA, espically PBGA packages. I wonder if 96.5Sn/3.5Ag (m.p .221 oC) or 58Bi/42Sn (m.p. 138 oC) would be suitable candidates? Do you have any experience on this subject? | | | | K
Electronics Forum | Mon Aug 17 02:45:18 EDT 1998 | Bob Willis
| 5 micrograms per sq. cm. is actually not too clean. The maximum military allowed post-clean, on-board contamination is 5.7 micrograms of NaCl /cm squared (when using the Zero-Ion brand ionic contamination tester). | We are use to seeing cleanlines
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