Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Thu Dec 18 05:43:44 EST 2003 | ex maintain leader
Nord- und S�damerika drucken��� USA Habasit Belting, Inc. (Affiliated Company) 305 Satellite Blvd P.O. Box 80507 USA-Suwanee, GA. 30024 Telefon: ++ 1-678-288 36 00 Fax: ++ 1-678-288 36 51 Videoconference: ++1- 678-546 34 59 E-Mail: hbi.h
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Fri Dec 24 05:12:08 EST 2004 | Patrick Tavernier
Hi ! Thank's for your replies. I'm seeing you're very concerned about this subject. I think RoHS and WEEE arrive too soon. Not technological solution about whiskers and tin pest. RoHS implicates a lot of money for to implemente news process. We must
Electronics Forum | Tue Feb 01 15:54:53 EST 2005 | jbrower
Hi George, The simple answer is that if you're company only does business in the US, or South america or Antartica or any where else that you aren't frozen out due to RoHS and the WEEE directives, then going lead free may not make sense. Unless your
Electronics Forum | Fri Feb 04 08:15:02 EST 2005 | aj
We are starting to look at doing some trials at the mo. I have attended a couple of seminars with one on Wave Soldering coming up soon.Loads of info. now have to make sense of it all. Just a couple of questions/advise on how other people have approa
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
.gif)
