Electronics Forum: 362 (Page 1 of 12)

Re: coating with no-clean?

Electronics Forum | Fri Jan 14 13:28:13 EST 2000 | DaveH

EMPF is now in Philadelphiaunder the auspices of the American Competitiveness Institute. Ph 610-362-1200 Fax 610-362-1290 www.empf.org

BGA -X-Ray Services

Electronics Forum | Wed Sep 05 10:55:15 EDT 2001 | caldon

ACI in Philadelphia can do this inspection. contact Barry Bloom at 610-362-1200 x 222. We can quote it per board, lot, component, time. what ever fits your need. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org

SMT Production

Electronics Forum | Wed Feb 09 16:33:53 EST 2005 | davef

American Competitiveness Institute Work: 610-362-1200 Fax: 610-362-1290 Other: www.empf.org Electronics Manufacturing Productivity Facility One International Plaza - Suite 150 Philadelphia, PA 19113 We have no relationship, nor receive benefit fr

Lead Free Process

Electronics Forum | Thu Jun 21 11:58:15 EDT 2001 | caldon

The data for this is overwhelming. My best advice would be to contact our lead-free specialists Lee Whitemann or Blaine Partee. Blaine's email is bpartee@aciusa.org Phone 610-362-1200 x 209. Lee's email is lwhitemann@aciusa.org Phone 610-362-1200 x

Solder joint Analysis

Electronics Forum | Sat Jan 01 10:14:30 EST 2005 | davef

East coast, solder connection failure analysis labs in the vacinity of New England are: * American Competitiveness Institute, Electronics Manufacturing Productivity Facility, One International Plaza - Suite 150, Philadelphia, PA 19113(610) 362-1200 F

Re: lead free soldering

Electronics Forum | Thu Nov 30 22:47:54 EST 2000 | CAL

Contact Lee Whiteman @ ACI/empf. Lee is an industry expert in Leadfree soldering. He has also ran an IPC leadfree work shop involving a DOE on Leadfree Screen Printing. Lee can be reached at lwhiteman@aci-corp.org or 610-362-1200. Best regards, Cal

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

Re: BGA problem: open after reflow

Electronics Forum | Sun Jan 21 16:42:35 EST 2001 | davef

I just can not get over the size of these crystals. What is the chronology of and the span of the thermal cycles this BGA has seen.[Just guess at the fabrication cycles, if it's difficult to determine]

seeking better process

Electronics Forum | Wed Mar 21 16:28:37 EST 2001 | CAL

ED- We can help you. It is our specialty and we are right next door at the Philadelphia Airport. Please touch base with me. Cacdriscoll@aci-corp.org 610-362-1200 x 272 Cal Have I got a machine for you

Solid Solder Deposit

Electronics Forum | Tue Apr 24 10:37:45 EDT 2001 | caldon

A small SMT line? I have conections for a New screen printer (MPM), Essemtec Placement machine, and Reflow oven (Electrovert) for $100K Let me know how interested you are. Caldon W. Driscoll ACI USA 610-362-1200 cdriscoll@aciusa.org

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