Electronics Forum: 4.5 (Page 11 of 24)

Re: Login is enabled

Electronics Forum | Fri Feb 26 11:39:21 EST 1999 | Cunli

There are only 4-5 corrupted registrations. We have notified or tried to identify and then notify them. Others can log in by typing in their username and password. Even those who did not complete their registration can log in and be prompted to comp

lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 07:06:15 EDT 1998 | joakim fagerlund

We have problems with voids when we solder lids to ceramic flatpackages. The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel The solder is attached to the lid (preform) and the solder material is Au/S

vapour phase reflow soldering technology

Electronics Forum | Fri Feb 01 06:15:46 EST 2002 | nifhail

This can be a solution for IC/BGA soldering for lead-free process isn't it ? See, most of the reflow profile set meets solder paste specification but often violating ICs or BGA requirement. Most of the solder paste required temperature of about 205 -

Question about Universial GDM

Electronics Forum | Tue Apr 23 07:38:27 EDT 2002 | jeremyt

Hi there. I Have a question that hopfully someone on here can answer for me. On a Universial GDM, is there anyway to get all 4 pumps (pistion style) to purge at the same time. The software only allows for one pump at a time. The reason i am trying to

Sn/Pb diffusion

Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring

Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th

Camalot 2800

Electronics Forum | Wed Apr 02 14:47:59 EST 2003 | slthomas

Operating Parameters X Direction (left to right) 18.0 inches Y Direction (front to back) 18.0 inches Z Direction (up and down) 1.5 inches Operating Speeds Slew speed and point-to-point is 20 in./sec. Eight increments of speed control from 0.01 in./

Wave soldering profiling

Electronics Forum | Fri May 07 17:38:00 EDT 2004 | bruce @ knoll

I will try that next. I did speed up the wave pump motor with a larger pully(20% more speed) This was done at the time to try to increase the size of the wave because I had component leeds touching the wave pot as they passed by. Due to the wave high

UIC Radial Inserter

Electronics Forum | Fri Jul 11 00:31:31 EDT 2003 | swuicsup

Marcel, Reconfiguring your machine from 80 to 20 stations is quite easy. In the sequencer portion of your machine, it has it's own I/O box. in it, there's the MIT card, location (1). The bit switches are there to inform the controller in the in

Used equipment sales

Electronics Forum | Fri Oct 24 13:35:11 EDT 2003 | cnotebaert

Ok, I have been trying to purchase a magazine unloader (front of line to load brds into smt equip) from 3 different used equipment manufacturers. I have been hounding them for 4-5 weeks to get me a quote. They all tell me they have them but I have no

Freshman in SMT industry needing advice

Electronics Forum | Thu Mar 04 14:20:41 EST 2004 | Robert

Another question... I use 500gm jars of Kester 256. After a job is complete the used solder is collected and put back into the jar. Generally while a job is run, the jar and used paste could be left out/open for up to 4 hours. A piece of seran wrap i


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