Electronics Forum | Tue Apr 27 11:53:36 EDT 2021 | dontfeedphils
When I was looking at Mirtec (4-5 years ago) I wasn't very impressed compared to Koh Young. It was easy to tell that Koh Young started with 3D and then added 2d features where needed, and that Mirtec had done the opposite. There's nothing wrong wit
Electronics Forum | Wed Jun 04 18:57:37 EDT 2003 | Rivkin
Hi Guys, How do you calculate throughput? and what's the standard allowance for some hidden downtimes like pick-up miss, pick-up errors, parts/feeder replenishment etc. say i have 4 machines that are not properly balanced in tact time: A= 3 mins
Electronics Forum | Wed May 04 10:42:55 EDT 2005 | nice90
Handling a PCB 1. Check your ESD slippers and ESD Strap first before entering the SMT production line 2. A PCB manufactred over 90 days must be stored first on the baking Oven before Production 3. Temperature on the Baking oven must be 125plus and m
Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Tue Jun 26 21:41:10 EDT 2007 | davef
4.4 Determine the amount of flux on the board. 4.4.1 Get a piece of corrugated cardboard and a weighing scale accurate to 0.01 grams. NOTE: Use cardboard with alcohol fluxes to slow their evaporation and get good data. 4.4.2 Weigh the cardboard. 4.4
Electronics Forum | Wed Aug 21 17:50:05 EDT 2002 | davef
First, it�s GREAT that your defect rate of 282 is very close to your Boss� goal of 50 ppm. Second, your Cpk and your ppm numbers don�t tie out with our expectations. You say Cpk for: * mounter is 1.0 and �your mounting is 83ppm�. * printing is 1.33
Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris
I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog
Electronics Forum | Wed Nov 15 10:26:54 EST 2000 | Rkevin
I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in
Electronics Forum | Wed Nov 15 10:24:23 EST 2000 | Rkevin
I'm looking for what I call Mylar, for lack of a better name. We used it at Digital/Compaq to help us knead paste and also to check alignment of prints without actually applying any paste to the module. It was about 4-5 mils thick, clear and came in
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
