Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Thu May 03 01:07:18 EDT 2007 | pavel_murtishev
Good morning, Worth system for 0.5mm or more pitch paste printing. For less pitch (uBGA, 0.4mm etc) framed stencil are preferred due to better tensioning. Main issue with them is handling. Stencil apertures that are used for tensioning might be easi
Electronics Forum | Fri Sep 21 10:31:44 EDT 2007 | russ
this would be meaniung that somewhere in your documantation it should have spec called "repeatability" what this means is that when the vision aligns the stencil/board, the board will always be within "x" amount of the njominal xy "T" position, some
Electronics Forum | Fri Feb 22 09:10:51 EST 2008 | mulder0990
AJ, You can use 0402 feeders to place the 0201 parts. I would suggest getting the feeders you are going to use calibrated before trying to run the parts. Also, another good idea is to get some 0.4mm tape leaf covers for the feeders. They will h
Electronics Forum | Mon Mar 17 20:50:34 EDT 2008 | keithej2
SMT Research has offered to sell us 0.4mm nozzles for tests. Even if the camera worked with the nozzles and parts (which I doubt) I don't think the CP4 has the x-y accuracy to place 0201s well. We'll see, they are ordering the nozzles, test parts and
Electronics Forum | Wed Jul 23 13:20:24 EDT 2008 | jdumont
Afternoon all, wondering if anyone can suggest a process for the localized removal of silk screen wording from a PCB. I have tried using a scalpel successfully but that it too time consuming and prone to error if an operator were to do it. Obviously
Electronics Forum | Wed Aug 27 11:09:55 EDT 2008 | fede
I�m interested in the F1 model, due to the possibility of this system to be configured with 1 top camera and 4 side. We are manufacturing 0402 and 0.4mm fine pitch Lead Free, and our PCB�s quality is not very good. With just one camera are you able t
Electronics Forum | Mon Feb 16 14:18:30 EST 2009 | jorge_quijano
1000 0402's, Micro BGA, QFP 0.4mm pitch, TSOP), we are trying to know what kind of equipment do you recommend to use in our factory, we already have Screen Printer, Chip shooters, Reflow oven, AOI, Stencil cleaner (manual), X ray, ICT... what else do
Electronics Forum | Fri Nov 19 10:23:07 EST 2010 | adetuc
Hi, Does anyone know what the placement success percentage is for lead components And the placement success percentage for lead free BGA components. We place many varieties of BGA devices, over 100 different size parts, from 1000 pin BGA to small 4mm
Electronics Forum | Sun Dec 26 15:57:49 EST 2010 | darlur
Hi, I got LS3000 but Im missing of some following parts: -Fiber-optic rigid probe -Flexible Optical Probe, 0.4mm (.015”)diameter P/N 106-0047-P1 Does anyone know where can I get them? All the best,
