Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
Electronics Forum | Thu Oct 05 16:12:09 EDT 2006 | Mario Scalzo, SMT CPE
* Try 1.5C / sec from RT to 165C * Hot soak at 165-175C for up to 2 minutes (I'd start with 60 seconds flat soak.) * 60-90 seconds TAL (I's start with 60) * 230-240C Peak. Thanks, Mario
Electronics Forum | Mon Mar 31 01:20:42 EST 2003 | Bryan Sheh
I agree that we should bake the pcb at higher temp and for longer time.for example...95--115c for at least 4 hours. also,keep the temp from 150--170c ,60-90 seconds while preheating. completely keep the moisture and volitales out of pcb and solder pa
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Thu Oct 25 14:15:18 EDT 2012 | kkay
Yes it looks like I attached the wrong reflow profile and I'll get the new one in there. Our TAL should be between 60-90 sec over 217. I'm not sure the embrittlement would be an issue as we have seen this issue across at least 3 different board vendo
Electronics Forum | Mon May 20 15:43:01 EDT 2013 | ngotranbestek
Hi I meet problem by PCB with diameter 300cm and thick 6mm i used tin-lead with profile normal, soak time 60-90 sec, Temp peak is 220 degree C, But solder see not good, not shiny. Any body recomend help me to fix this problem for Hard gold playing.
Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
Electronics Forum | Thu Jul 01 23:56:06 EDT 2004 | rsthompson
I'm having a philisophical discussion with my boss regarding long reflow soak times to improve soldering under BGA devices. Is there anything to be gained by extending soak times at the 150C level from 60-90 seconds to 5-10 minutes? I've never seen