Electronics Forum: pll (Page 1 of 1)

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 08:45:24 EST 2002 | davef

Not dumb at all. It's a 16 pin, 0.65mm plastic SMT package with pads along the package edges proprietary to Fujitsu. Look here: http://www.fme.fujitsu.com/products/pll/pdf/bccover.pdf

Fighting solder beads

Electronics Forum | Tue Mar 21 21:03:55 EST 2006 | davef

1 Chatter about mask opening � No BIG problems with these statements. It�s just that you may need to tailor your reflow recipe to minimize these escapees. 2 Stencil design - Any area ratio below 0.66 is going to very challenging to print, as you ca

Fighting solder beads

Electronics Forum | Sat Mar 18 02:21:31 EST 2006 | pavel_murtishev

Good morning, Once again a met annoying solder beading issue while producing board with PLL (leadless, contacts from the bottom side of the package). Board has very high placement density and beads appear near PLL package only. This package is finep

Fighting solder beads

Electronics Forum | Tue Mar 21 02:15:26 EST 2006 | pavel_murtishev

Good morning Dave, Here are some of my assumptions. Please correct me if I am wrong. 1. Mask opening. Due to mask to PCB misregistration mask is not always centered relative to pad center how is should be. Sometimes edge of the mask matches with ed

Fighting solder beads

Electronics Forum | Mon Mar 20 22:39:03 EST 2006 | davef

Pavel Point: You suspect that solder paste can easily get to solder mask causing beading, because the aperture is larger than the component pad. Comment: Probably, this is incorrect. We overprint on solder mask all day long when doing paste-in-hol

Re: problem when testing the RF product

Electronics Forum | Wed Jun 23 16:54:16 EDT 1999 | Frank Frimpong

| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit


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